USPTO Extends its Bump-and-Dump Program for Additional YearPrint PDF
The March and July, 2010 issues of Nutter’s IP Bulletin reported on the USPTO’s Patent Application Backlog Reduction Stimulus Plan, more colloquially known as the “Bump and Dump” program. On November 22, 2010, the USPTO announced that the program is being extended through December 31, 2011, or until 10,000 petitions have been granted, whichever occurs earlier. The program provides an applicant the opportunity to “bump” one application up in the examination queue if they agree to “dump” (i.e., abandon) another pending unexamined application. Applicants should consider reviewing their portfolios and determining if any applications awaiting a first Office Action, or any future filings, are appropriate for this expedited process.